High Speed Computer Packaging Technology and Issues in Microjoining Technology.

High speed Radix-4 Booth scheme in CNTFET technology for high performance parallel multipliers

A novel and robust scheme for radix-4 Booth scheme implemented in Carbon Nanotube Field-Effect Transistor (CNTFET) technology has been presented in this paper. The main advantage of the proposed scheme is its improved speed performance compared with previous designs. With the help of modifications applied to the encoder section using Pass Transistor Logic (PTL), the corresponding capacitances o...

MCM: The High-Performance Electronic Packaging Technology

Modern Electronic Packaging Technology

A view of modern electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protecti...

Semiconductor Packaging Assembly Technology

This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical and environmental protection to ensure reliability and performance. Three fundamental assembly flow processes ...

The Evolution of High-Speed Transceiver Technology

The Internet revolution has led to a massive increase in data traffic. This trend is set to continue; over the next few years and it is likely that 95% of all communication traffic will shift to data. The need to support high bandwidth traffic has required that equipment performance grow at an exponential rate. WAN equipment which only two years ago operated at speeds of OC-48 (2.5Gbps) now run...